Thermal paste Thermaltake TG-30 for heatsink 4.5 W/m·K

High thermal conductivity
TG-30 is the highest quality thermoconducting paste for high cooling efficiency, designed to effectively reduce the temperature of the processor. The thermoconducting mixture contains diamond powder, which guarantees thermal conductivity of 4.5 W/m-k, which can satisfy the basic needs of most users.

Easy to apply
Specially developed Thermoltake thermoconducting paste perfectly fits the honeycomb pattern, which provides an easier way to apply thermoconducting paste to a neat and well-covered surface that fits all processors.
High quality thermoconducting paste ensures longer service life, eliminating drying or cracking during use. The power-free mix provides better security for you and your system.